Building Foundations for Student Success
June 3, 2018 - June 6, 2018
Building Foundations for Student Success Engineers will form an integral part of the global leadership team that will grapple with the difficult challenges of the 21st century. To ensure they are successful in these tasks, we must foster the development of wide range of educational, career, and life competencies in our students. Come join us for important conversations about practices and strategies that positively impact student abilities, resourcefulness, persistence, and success.
Registration opens April 1, 2018 CDT
Early bird registration is open until May 1, 2018 CDT
Learn MoreVenue / Accommodations
For information on where the conference is being held and negotiated conference accommodation rates please click the learn more on the top of this section.
All areas of engineering education research and practice are invited to submit papers and workshop proposals. The CEEA-ACEG conferences offer a unique venue for academics and practitioners to discuss recent trends in engineering education and education research. The conference normally includes workshops, plenary sessions and technical sessions.
The schedule is provided as an overview and is updated regularly as details are confirmed.
The conference committee looks for speakers to address the CEEA-ACEG Membership with interesting topics that fit into the theme of the conference each year.
Sponsorship of the CEEA conference is a great way to promote your company or organization. We provide a variety of sponsorship levels with fantastic benefits for all of our sponsors.
Being an exhibitor of the CEEA conference is a great way to promote your company or organization. We provide space in an area that is near where most of the conference attendees will pass through allowing for good exposure. We also offer fantastic benefits for all of our exhibitors.
Learn MoreContact Us / Committee
A listing of the conference planning committee along with a conference email can be found through the learn more link.